CITE2021 Hongxinyu shines, builds a domestic ecological closed loop, and helps domestic ecological layout

Publisher: Time:2021-04-13 Views:461    

From 2013 to 2021, the national electronic information industry chain display platform jointly created by the Ministry of Industry and Information Technology and the Shenzhen Municipal People’s Government-China Electronic Information Expo (CITE) has become an important "industry" in the field of electronic information technology. The "weather vane", "technical weather vane" and "innovation weather vane" collectively reflect the latest development achievements in the field of electronic information.




From April 9th to 11th, 2021, the 9th China Electronic Information Expo (CITE2021) will arrive as scheduled, fully displaying representative electronic information including smart homes, 5G+ Internet of Things, industrial Internet, integrated circuits, and big data storage for the industry. The core content of the future development of the industry.


As an important branch of the semiconductor industry, the memory chip industry has ushered in an explosion in recent years. According to statistics from the World Semiconductor Trade Statistics Association (WSTS), the size of the memory chip market in 2019 alone exceeded 100 billion U.S. dollars.


Full range and full coverage product layout Pass the warmth behind digital technology, and keep moving forward for a better "core" life


At CITE2021, Hosin will exhibit with a full range of storage products: flash drives (UDP\PCBA), embedded storage (eMMc\eMCP\UFS), micro-capacity storage (SPI NAND\MLC\Flash TLC), memory card (NM Card\ Micro SD\ SD) solid state drives (SATA SSD\ PCIE SSD), memory products (DDR\LPDDR\DRAM Module), widely used in consumer electronics, industrial electronics, Internet of things, cloud computing, mobile applications, artificial intelligence and other fields .

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At this exhibition, Hosin not only brought the world's first 40nm USB 3.2 Gen1x1 standard flash drive master chip: HG2319, but also the first nationally produced eMMC series in China. DRAM used in TV/STB/OTT/GPON/EPON and tablet-related consumer electronic products, DRAM Module serving desktop and notebook computers, high-speed and economical SSD solid state drive series, supporting multi-wafer large-capacity memory cards Micro SD/SD, Huawei NM card patent authorized brand NM card and SPI NAND, a miniaturized storage product adapted to the consumer electronics field. The full range and full coverage of products, full of sincerity and innovation, meet all the needs for storage products on the market.




On the first day of the exhibition, at the Hosin booth (1C045) in Hall 1, Shenzhen Convention and Exhibition Center, a dazzling array of storage “chips” attracted waves of exhibitors and professional visitors to “look on” and consult.


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Create a "core" to drive manufacturing, build a domestic ecological closed-loop, and help domestic ecological layout


Chips are the core technology in the field of science and technology, but China's dependence on overseas semiconductors is still prominent. Statistics show that China is the world's largest importer of semiconductors, and it purchased foreign-made chips worth more than US$300 billion in 2019.




The development trend of emerging industries such as artificial intelligence, Internet of Things, and cloud computing is improving. All kinds of electronic and intelligent devices are inseparable from the application of memory chips, and a Chinese "core" is part of the future national strategy. With the international environment's "stuck neck" on core technologies such as China's core technology, the country vigorously develops independent chip research and development, and the chip market will be the main theme of the market this year and beyond! This has also directly promoted the motivation and determination of related companies in the chip industry chain to quickly deploy domestic chips.




 Hosin has always focused on the storage industry field, guided by market demand, centered on technological innovation, empowered terminal applications with storage "chips", established a domestic upstream raw material supply chain, and independently researched and developed hardware with its own strong research and development capabilities. And firmware, domestic filming and packaging and testing, build a domestic ecological closed loop, and help domestic ecological layout. At present, the company has reached a strategic cooperation with YMTC, becoming its diamond-level ecological partner, taking YMTC NAND Flash particles as the common value and "Xtacking graphic trademark" as the unified visual identification ecosystem, and through the innovation of upstream and downstream enterprises in the alliance Integration, the Xtacking graphic trademark has become synonymous with high-end memory with strong performance, technological innovation, and reliable quality. Promote mutual benefit and win-win results, build an ecosystem, jointly cultivate the domestic and international storage markets, and assist the ecological layout of domestic cores.

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Hosin's domestically produced HG2319 is the world's first 40nm USB 3.2 Gen1x1 flash drive main control chip. Compared with the 72bit adopted by the industry, the HG2319 has enhanced the storage fault tolerance rate and realized the smallest area design among the industry's products. The first domestic eMMC series produced this time adopts the latest eMMC 5.1 version protocol, is equipped with independent controllable master control and domestic NAND Flash. It is the first domestic company to realize integrated master control, NAND Flash, firmware R&D design, Manufacturers whose packaging and testing are all localized. It has been widely used in applications such as mobile phones, TVs, tablet computers, car after-installation systems, and advertising players.


In the context of the global development of high-tech, emerging industries such as artificial intelligence, the Internet of things, and cloud computing are developing well. As a chip R&D and design company, Hosin uses its own strong R&D strength to help localize the layout, whether it is In terms of R&D level, technical background, industry resources, and product layout, they are full of horsepower.




At the exhibition site, Chen Guirong, vice president of sales of Shenzhen Hosin Electronics Co., Ltd., and Zhu Zixuan, secretary of the board of directors, were interviewed by reporters, clarifying the application practice and future product layout of Hosin's use of "chips" to promote digital construction in the storage field.


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Continue to open up innovation in the field of technology


At present, Hosin has set up R&D centers in Shenzhen, Taiwan, and Hefei (R&D headquarters), with 80% of R&D personnel. It gathers senior talents from Taiwan, Hong Kong, Macau, Singapore and other places, and has more than 100 patent certifications and software copyrights. Establish a joint laboratory and continue to develop innovation in the field of technology.




In-depth cooperation with industry giants


At the same time, Hosin has in-depth cooperation with industry giants to maintain close contact in terms of R&D architecture and technical team building, forming a strategic upgrade for the continuous innovation and development of new technologies, and establishing the company's leading technological position.




Decades of deep cultivation in the storage field


 In addition, the company’s leading figures and core team have been deeply involved in the storage field for decades, possessing strong upstream resource integration capabilities and business awareness in product segmentation, keeping up with market demand, grasping market trends, and occupying an important role in the industry chain. Link.




Complete product line layout


 At present, Hosin is stepping up the deployment of innovative applications in the entire industry chain of memory chips, and has formed a complete product line layout. In a short time, Hosin launched three chip products for the consumer market: the self-developed HG2319 has been mass-produced, the eMMC5.1 main control chip CS8232 will also be mass-produced in the second half of the year, SATA2259 and the new SATA SSD series product HG2259 , It is completely independently developed by Hosin and adopts a 28nm process. It has stable performance and ultra-high cost performance, and has an absolute advantage in the market.




In the future, for the server market, two storage products, SSD Gen3X4 and SSD Gen4X4, will also be launched; at the same time, in response to the rapid growth of the automotive electronics industry, Hosin plans to launch a new vehicle-level UFS. Facing the rapid growth of big data demand and the quantitative development of the data sea, Hosin will also actively deploy in the big data, server, AI intelligence, automotive electronics and other markets, and based on deep knowledge and accumulation, drive the storage field more To be reliable and trustworthy, it helps the domestic storage industry to go deeper.


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